lihlahisoa

Likarolo tsa bohlokoa tsa 200 Series baseplates ke:  Bakeng sa li-baseplates tse tšehetsang FBM: • 2, 4, le 8 modules positions hammoho le ho hloma o otlolohileng le ho rapama • Khokahano ea tšimo bakeng sa likopano tsa ho emisa I/O, li-adapter tse sa hlokahaleng le li-identifiers tsa module bakeng sa mojule o mong le o mong • DIP switch bakeng sa ho tsebahatsa likarolo tse itseng tsa Modular • Badding tšebeletso (e hloka bese e sa hlokahaleng)  Khokahano ho 2 Mbps Module Fieldbus bakeng sa Standard Fieldbus Modules, kapa ho 268 Kbps Fieldbus bakeng sa 100 Series FBMs  Li-splitters/terminators bakeng sa strobe ea nako le A/B Fieldbus  Khokahano bakeng sa 000000 FCP2Mstrobe ea boikhethelo le GPS2M7 tšehetso ea nako ea FCP7 baseplates  Primary le secondary 24 V dc power and communication connections  Ho ikamahanya ka morao le li-subsystem tsa I/O tse lumellang katoloso ea kamoso ntle le lisebelisoa tse ling tsa khokahanyo  Maemo a koaletsoeng a inehetseng ho CP kapa FCM/FBM feela, ho latela mofuta oa baseplate  Passive backplane ho eketsa ts'epahalo ea sistimi.